Link solder ball linking device for integrated circuit packaging

The invention discloses a link solder ball linking device for integrated circuit packaging. The device comprises a welding device, a transmission device, a placing device and a base, wherein a slidinggroove is formed on the base, the placing device is arranged in the sliding groove in a sliding mode...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	PANG SHIDE, RUAN HUAIQI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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