Link solder ball linking device for integrated circuit packaging

The invention discloses a link solder ball linking device for integrated circuit packaging. The device comprises a welding device, a transmission device, a placing device and a base, wherein a slidinggroove is formed on the base, the placing device is arranged in the sliding groove in a sliding mode, the welding device used for being connected with a solder ball is arranged above the placing device, and the transmission device used for pushing the placing device to move is arranged on a side face of the placing device. The link solder ball device for integrated circuit packaging is advantagedin that a vertical electromagnetic guide rail and a transverse electromagnetic guide rail can be matched through an infrared sensor so that a welding gun can correspond to the position needing to bewelded all the time, an objective table can be conveniently pushed by the transmission device in the sliding groove, welding and next-step work are integrally operated, welding efficiency is improved,and welding production effi