Encapsulating slurry for aluminum nitride substrate, and preparation method and application thereof

The invention provides an encapsulating slurry for an aluminum nitride substrate. The encapsulating slurry comprises 65-80 wt% of a glass powder, 0-10 wt% of an inorganic additive and 10-35 wt% of anorganic carrier; and the glass powder is prepared from 50-75 wt% of ZnO, 1-15 wt% of SiO2, 0-3 wt% of Al2O3 and 7-45 wt% of H3BO3. The encapsulating slurry for the aluminum nitride substrate is perfectly matched with the expansion coefficient of the aluminum nitride substrate, is sintered to form a smooth and flat surface, has a good binding force, and is free of toxic elements such as lead, chromium and mercury; and particularly, after the encapsulating medium slurry is sintered on a circuit on the surface of the aluminum nitride substrate, the resistance change rate of a resistance layer before and after the sintering is less than +/-5%. The invention further provides a preparation method and an application of the encapsulating slurry for the aluminum nitride substrate. 本发明提供了一种氮化铝基板用包封浆料，包括：65～80wt％的玻璃粉；0～10wt％