Wire bonding device
The invention relates to a wire bonding device, and relates to the technical field of wire bonding equipment. The wire bonding device comprises a movable part made of a conductive material, a wire crimping tube and a U-shaped fixing part. An arc-shaped slot A is arranged on one side wall of the fixi...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a wire bonding device, and relates to the technical field of wire bonding equipment. The wire bonding device comprises a movable part made of a conductive material, a wire crimping tube and a U-shaped fixing part. An arc-shaped slot A is arranged on one side wall of the fixing part. The movable part comprises an engaging part and a bolt. The engaging part is arranged in the U-shaped slot of the fixing part and can slide along the bottom surface of the U-shaped slot of the fixing part. An arc-shaped slot B corresponding to the arc-shaped slot A is arranged on one side,which is close to the arc-shaped slot A, of the engaging part. The bolt comprises a screw and a head. The screw is screw-connected with the fixing part and passes through the fixing part to contact the engaging part. The wire crimping tube is integrally connected with the side wall, which is provided with the arc-shaped slot A, of the fixing part. The wire bonding device provided by the inventioncan perform wire bonding i |
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