Mounting substrate, intelligent power module and air conditioner

The invention discloses a mounting substrate, an intelligent power module and an air conditioner. The intelligent power module comprises a ceramic layer, wherein the ceramic layer comprises a first surface and a second surface which are oppositely arranged; a copper clad layer which is arranged on the first surface of the ceramic layer; and a metal heat dissipation layer which is arranged on the second surface of the ceramic layer, wherein the metal heat dissipation layer is provided with a stress relief hole. The stress relief hole is arranged, and the stress generated by the intelligent power module is released through the stress relief hole so that the fracture caused by the stress concentration formed on the insulating layer can be prevented and the strength of the intelligent power module can be enhanced. 本发明公开一种安装基板、智能功率模块及空调器，该智能功率模块包括：陶瓷层，陶瓷层包括相对设置的第一表面和第二表面；覆铜层，设置于陶瓷层的第一表面；金属散热层，设置于陶瓷层的第二表面，金属散热层上设置有去应力孔。本发明通过设置去应力孔，智能功率模块产生的应力通过该去应力孔被释放，可以防止在绝缘层上形成应力集中而造成断裂，从而有利于提高智能功率模块的强度。