THERMAL MANAGEMENT PLANES

Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottomcasing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermalconduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns. 一些实施例包括热管理平面。所述热管理平面可以包括：顶部壳体，其包括聚合物材料；顶部封装层，布置在顶部壳体上；底部壳体，其包括聚合物材料；底部封装层，布置在底部壳体上；将底部壳体与顶部壳体耦接的气密密封件；布置在底部壳体和顶部壳体之间的芯吸层；多个间隔物，其布置在顶部壳体和底部壳体之间、在真空芯内，其中，多个间隔物中的每个均具有低热导性。在一些实施例中，热管理平面的厚度小于约200微米。