Die and process for attaching adhesive tape to 3D stereoscopic mica surface

The invention discloses a die and process for attaching adhesive tape to a 3D stereoscopic mica surface. The die comprises a die body. The die body comprises a male die and a female die. A forming cavity is formed in the center of the male die. A forming pressing plate is arranged at the center of the forming cavity. Positioning blocks are arranged on the periphery of the male die. A forming cavity is also formed in the center of the female die. A forming groove is formed in the center of the forming cavity. A #-shaped coarse surface is arranged on the inner surface of the forming groove. Positioning grooves matched with the positioning blocks are formed in the periphery of the female die. The process includes the steps of attaching the adhesive tape to the mica attached surface in advance, conducting heating so that gum can permeate into the mica attached surface, cooling and solidifying the gum on the mica, and then conducting reheating and punch forming. By changing the molecular structure of the mica atta