Packaging base material with high glass transition temperature and production method thereof

The invention discloses a packaging base material with high glass transition temperature and a production method thereof. The packaging base material comprises a base layer and a film protective layer, wherein the base layer comprises the following raw materials in parts by weight: 20 to 30 parts of BT resin, 20 to 30 parts of epoxy acrylic resin, 10 to 20 parts of polyurethane acrylic resin, 5 to10 parts of a coupling agent, 5 to 10 parts of a base material filler and 1 to 5 parts of a thickener; and the film protective layer is a thin epoxy glass cloth base material. The invention relates to the technical field of circuit board base materials. According to the packaging base material with high glass transition temperature and the production method thereof, the glass transition temperature index of the packaging base material can be effectively promoted by improving the material components of the base material, the purpose that the packaging material can preferably resist high temperature by using epoxy resi