SEMICONDUCTOR DEVICE

The invention provides a semiconductor device which can reduce the internal resistance, and the semiconductor device includes a semiconductor element made up of a semiconductor substrate, an element electrode formed on the substrate, and a wiring layer electrically connected to the element electrode. The semiconductor device further includes a lead frame supporting the semiconductor element, a first conductive member electrically connecting the semiconductor element and the lead frame, a second conductive member overlapping with the semiconductor element as seen in plan view, and a sealing resin covering the semiconductor element, a part of the lead frame, and the first and second conductive member. The wiring layer includes a first pad portion and a second pad portion. The second conductive member has a first connecting portion bonded to the first pad portion and a second connecting portion bonded to the second pad portion. 本发明提供一种半导体器件，其可实现内部电阻的降低。本发明的半导体器件包括：半导体元件，其包括：具有在z方向上彼此朝向相反侧的衬底主面和衬底背面的半导体衬底、形成于衬底主面