Plasma system and method for processing edge defects of substrate

The invention discloses a plasma system and method for processing edge defects of a substrate. The plasma system comprises a plasma source and a bearing device, the plasma source comprises at least one plasma generating unit. The bearing device is used for conveying at least one substrate to move relative to the plasma source so as to enter and exit a plasma action area; wherein the substrate is provided with a to-be-processed area, the plasma source provides a plasma beam for the to-be-processed area in the plasma action area, and the advancing direction of the plasma beam is substantially parallel to the surface of the substrate; the method comprises the following steps: moving a substrate into a plasma action area, and providing a heat source with a temperature gradient and a reactive chemical component in a to-be-processed area through a plasma source so as to carry out heat treatment and modification on the edge of the substrate. 一种处理基板边缘缺陷的等离子体系统及方法，等离子体系统包括一等离子体源与一承载装置；等离子体源包含至少一等离子体产生单元；承载装置用以输送至少一基板相