Method for producing material-bonded laser bonding connection and to device for carrying out method
The invention relates to a method for producing a material-fitting laser bonding connection, wherein in a first method step a joining element made of a first material is provided, in a second method step, a contact element made of a second material is provided, in a third method step, wherein a cros...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a method for producing a material-fitting laser bonding connection, wherein in a first method step a joining element made of a first material is provided, in a second method step, a contact element made of a second material is provided, in a third method step, wherein a cross-sectional area of the joining element is formed having a reduced cross-section of the joining element, wherein the reduced cross-section is arranged perpendicular to the longitudinal direction of the joining element, in a fourth method step, the joining element and the contact element are connected to each other in a bonded manner under the effect of laser light or by ultrasonic waves, and in a fifth method step, after the production of the connection of the joining element and the contact element, the joining element is cut off in the cross-sectional area.
本发明涉及用于制造材料配合的激光接合连接的方法,其中在第一方法步骤中提供由第一材料构造的接合元件,在第二方法步骤中提供由第二材料构造的接触元件,在第三方法步骤中,构造具有接合元件的经减小的横截面的接合元件的截面区域,其中所述经减小的横截面垂直于所述接合元件的纵向来布置,在第四方法步骤中,在激光的作用下或者由超声波来 |
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