Silicon wafer production line

The invention provides a silicon wafer production line, which includes a first coating source drying component and a second coating source drying component. The first coating source drying component includes a first coating source mechanism, a first waste liquid collection barrel, a first draught fan, a first drying furnace, a first silicon wafer inverting mechanism, and a first robot. The secondcoating source drying component includes a second coating source mechanism, a second waste liquid collection barrel, a second draught fan, a second drying furnace, a second silicon wafer inverting mechanism, and a second robot. The second waste liquid collection barrel is connected to the second coating source mechanism. The silicon wafer production line further includes a cushion pad which is divided into a loading area, a working area and an unloading area. The loading area is provided with a basket turning mechanism. The unloading area is provided with a silicon wafer powder-spraying mechanism, a four-axis robot an