Dual cup enclosure for electronic devices

The present invention provides a dual cup enclosure for electronic devices. The enclosure for an electronic device includes a housing having a wall that defines a cavity that is configured to receivean electronic assembly therein. The wall includes tongue formed at a distal end. A cover includes a top wall and a side surface extending from the top wall to form a chamber. The housing is at least partially received within the chamber and the tongue of the housing is welded to a groove positioned within the chamber. Flash from the weld is contained within the enclosure so that no weld flash is visible on the exterior surface of the enclosure. 本发明题为"用于电子设备的双杯壳体。"一种用于电子设备的壳体包括外壳，该外壳具有限定被配置为在其中接纳电子组件的腔的壁。壁包括形成在远端处的舌状部。盖子包括顶壁和从顶壁延伸以形成室的侧表面。外壳至少部分地接纳在室内，并且外壳的舌状部被焊接到被定位在室内的沟槽。来自焊接部的焊瘤被包含在壳体内，使得在壳体的外部表面上没有焊接焊瘤是可见的。