STACKED CIRCUIT PACKAGE WITH MOLDED BASE HAVING LASER DRILLED OPENINGS FOR UPPER PACKAGE

A stacked package configuration is described that includes a bottom package and an upper package. The bottom package includes a substrate having a top surface with first circuitry and metal first pads. A molded layer is then formed over the substrate. Holes through the molded layer are then laser dr...

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Bibliographische Detailangaben
Hauptverfasser: BEVILLE FREDERICK E, ANDERSON MICHAEL J, NG DAVID R, BRAZZLE JOHN D, YING YUCHENG
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:A stacked package configuration is described that includes a bottom package and an upper package. The bottom package includes a substrate having a top surface with first circuitry and metal first pads. A molded layer is then formed over the substrate. Holes through the molded layer are then laser drilled to expose the first pads. The holes and first pads align with leads of an upper package, whichcontains further circuit components. The holes are then partially filled with a solder paste. A thermal epoxy is applied between the molded layer and the upper package. The leads of the upper packageare then inserted into the holes, and the solder paste is reflowed to electrically, thermally, and mechanically connect the upper package to the bottom package. The reflow heat also cures the epoxy.A ball grid array is then formed on the bottom of the substrate. 描述了堆叠的封装配置,包括底部封装和上部封装。底部封装包括基板,该基板具有带有第一电路的顶部表面以及金属第一焊盘。然后在基板上方形成模制层。然后通过模制层的孔经过激光钻孔以暴露第一焊盘。孔和第一焊盘与上部封装的引线对齐,后者包含更多的电路组件。然后用焊膏部分填充孔。在模制层和上部封装之间施加热环氧树脂。然后将上部封装的引线