HALF-SPLITTING CUTTING DEVICE AND HALF-SPLITTING CUTTING METHOD

The present invention provides a half-splitting cutting device for cutting an object in half efficiently and in a short time. This half-splitting cutting device (10) is characterized by being providedwith: a holder (20) for supporting an object (12) to be cut, the axis of which is disposed horizonta...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WANG GANG, MINEGISHI TAKAO, YAMADA MANABU, NAGASE TOMONORI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The present invention provides a half-splitting cutting device for cutting an object in half efficiently and in a short time. This half-splitting cutting device (10) is characterized by being providedwith: a holder (20) for supporting an object (12) to be cut, the axis of which is disposed horizontally; a feeding stage (60) for attaching said holder (20) on a base (62); a movement means (80) formoving the feeding stage (60) forward and backward parallel to the axis of the object (12) being cut; and a cutting means (20) for cutting parallel to the axis of the object (12) being cut. 本发明提供一种对半切割装置以及对半切割方法,将切割对象在短时间内有效率地对半切割。本发明的对半切割装置(10)的特征在于,具有:支承使轴横置的切割对象(12)的承载台(20)、将所述承载台(20)安装在基座(62)上的输送台(60)、使所述输送台(60)与所述切割对象(12)的轴平行地进退移动的移动装置(80)、以及与所述切割对象(12)的轴平行地进行切割的切割装置(20)。