Novel manufacturing process of busbar based on IGBT module

The invention discloses a novel manufacturing process of a busbar based on an IGBT module. When electronic components such as a busbar, an electrode and the like are adopted, a traditional bonding padform is abandoned. A novel positioning cylinder form is adopted. Through a pre-designed extended conductive component, on one hand, stable electrical connection is realized; on the other hand, an existing tool can be replaced to achieve an initial positioning effect. After a soldering paste is dropwise added, a welding procedure is directly performed. Cost and the assembling complexity are greatly reduced, an amount of the used soldering paste is greatly reduced compared with that in a traditional process, accurate and stable welding can be achieved only by dropwise adding a very small amountof soldering paste into a positioning cylinder, then cleaning pressure of a subsequent process is reduced, and even a cleaning-free state is achieved under a condition that a dropwise adding amount is strictly controlled. The