Trimming and forming die for integrated circuit packaging

The invention discloses a trimming and forming die for integrated circuit packaging. The die comprises an upper forming die and a lower forming die which are arranged up and down. The upper forming die comprises an upper forming plate, and comprises a gate punching male die, a trimming male die, a cutting male die and a forming male die which are mounted on the upper forming plate. The lower forming die comprises a lower forming plate, and comprises a gate punching male die, a trimming male die, a cutting male die and a forming male die which are installed on the lower forming plate. Through arranging gate punching dies, trimming dies, cutting dies, and forming dies on the upper and lower plates, semi-finished chip materials are enabled to pass through in sequence; glue injection separation, chip trimming, chip cutting and chip forming of plastic package are completed in sequence; the integrated process of chip trimming and forming is achieved. A separating die is arranged to eject outa formed chip material,