Multi-channel package and test apparatus and test method for testing the package

The present invention provides a multi-channel package capable of reducing a test cost while performing a test at a high speed, and a test apparatus and a test method of testing the multi-channel package. The multi-channel package includes: a package substrate; and at least two semiconductor chips mounted on the package substrate and having different channels, wherein each of the at least two semiconductor chips includes a built-in-self-test (BIST) circuit and operates in one of a self-test mode, a tester mode, and a target mode during a test, and in the tester mode or the target mode, the atleast two semiconductor chips are configured to be inter-channel cross-tested through an external signal path of the package substrate. 本发明提供了一种能够在高速执行测试的同时降低测试成本的多通道封装以及测试该多通道封装的测试装置和测试方法。多通道封装包括：封装基板；以及安装在封装基板上并且具有不同通道的至少两个半导体芯片，其中该至少两个半导体芯片中的每一个包括内置自测试(BIST)电路，并且在测试期间以自测试模式、测试器模式和目标模式中的一个进行操作，并且在测试器模式或目标模式中，该至少两个半导体芯片被配置为通过封装基板的外部信号路径进行通道间交叉测试。