METHOD FOR MANUFACTURING TRANSFER FILM INCLUDING SEED LAYER, METHOD FOR MANUFACTURING CIRCUIT BOARD BY SELECTIVELY ETCHING SEED LAYER, AND ETCHING SOLUTION COMPOSITE
The present invention relates to a method for manufacturing a transfer film including an electrode layer, the method comprising: an electrode layer formation step of forming an electrode layer on a carrier member by using a conductive material; a placement step of placing the carrier member on at le...
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| creator | CHUNG KWANGOON MOON BYUNG-WOONG KIM JAE-RIN KIM SU-HAN |
| description | The present invention relates to a method for manufacturing a transfer film including an electrode layer, the method comprising: an electrode layer formation step of forming an electrode layer on a carrier member by using a conductive material; a placement step of placing the carrier member on at least one side of an insulating resin layer respectively; a bonding step of bonding the carrier memberand the insulating resin layer together by applying pressure thereto; and a transfer step of removing the carrier member to transfer the electrode layer on the insulating resin layer.
本发明涉及一种包括电极层的转印膜的制造方法。根据本发明的包括电极层的转印膜的制造方法，其特征在于包括：在载体部件上利用导电性物质形成电极层的电极层形成步骤；在绝缘树脂层的至少一面上分别配设所述载体部件的配设步骤；加压所述载体部件和所述绝缘树脂层使之接合的接合步骤；及去除载体部件以在所述绝缘树脂层上转印电极层的转印步骤。 |
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本发明涉及一种包括电极层的转印膜的制造方法。根据本发明的包括电极层的转印膜的制造方法，其特征在于包括：在载体部件上利用导电性物质形成电极层的电极层形成步骤；在绝缘树脂层的至少一面上分别配设所述载体部件的配设步骤；加压所述载体部件和所述绝缘树脂层使之接合的接合步骤；及去除载体部件以在所述绝缘树脂层上转印电极层的转印步骤。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CONDUCTORS ; ELECTRICITY ; INSULATORS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191122&DB=EPODOC&CC=CN&NR=110494936A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191122&DB=EPODOC&CC=CN&NR=110494936A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHUNG KWANGOON</creatorcontrib><creatorcontrib>MOON BYUNG-WOONG</creatorcontrib><creatorcontrib>KIM JAE-RIN</creatorcontrib><creatorcontrib>KIM SU-HAN</creatorcontrib><title>METHOD FOR MANUFACTURING TRANSFER FILM INCLUDING SEED LAYER, METHOD FOR MANUFACTURING CIRCUIT BOARD BY SELECTIVELY ETCHING SEED LAYER, AND ETCHING SOLUTION COMPOSITE</title><description>The present invention relates to a method for manufacturing a transfer film including an electrode layer, the method comprising: an electrode layer formation step of forming an electrode layer on a carrier member by using a conductive material; a placement step of placing the carrier member on at least one side of an insulating resin layer respectively; a bonding step of bonding the carrier memberand the insulating resin layer together by applying pressure thereto; and a transfer step of removing the carrier member to transfer the electrode layer on the insulating resin layer.
本发明涉及一种包括电极层的转印膜的制造方法。根据本发明的包括电极层的转印膜的制造方法，其特征在于包括：在载体部件上利用导电性物质形成电极层的电极层形成步骤；在绝缘树脂层的至少一面上分别配设所述载体部件的配设步骤；加压所述载体部件和所述绝缘树脂层使之接合的接合步骤；及去除载体部件以在所述绝缘树脂层上转印电极层的转印步骤。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CONDUCTORS</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjEEKwjAQRbtxIeodxr2CpSJ0mU4mNpAmkk6ErkqRuBIt1Ct5Ty0IgiC4-vB470-TR0VcOgnKeaiEDUogB6_tHtgLWyvyoLSpQFs0QY68JpJgREN-BT9j1B6DZiic8BKK5lUZQtZHMg0QY_n9JKz8cGcCa2cBXXVwtWaaJ5Nzdxni4r2zZKlGex37WxuHvjvFa7y3aNN0s823ebYT2T_OE9L3RlI</recordid><startdate>20191122</startdate><enddate>20191122</enddate><creator>CHUNG KWANGOON</creator><creator>MOON BYUNG-WOONG</creator><creator>KIM JAE-RIN</creator><creator>KIM SU-HAN</creator><scope>EVB</scope></search><sort><creationdate>20191122</creationdate><title>METHOD FOR MANUFACTURING TRANSFER FILM INCLUDING SEED LAYER, METHOD FOR MANUFACTURING CIRCUIT BOARD BY SELECTIVELY ETCHING SEED LAYER, AND ETCHING SOLUTION COMPOSITE</title><author>CHUNG KWANGOON ; MOON BYUNG-WOONG ; KIM JAE-RIN ; KIM SU-HAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN110494936A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CONDUCTORS</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHUNG KWANGOON</creatorcontrib><creatorcontrib>MOON BYUNG-WOONG</creatorcontrib><creatorcontrib>KIM JAE-RIN</creatorcontrib><creatorcontrib>KIM SU-HAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHUNG KWANGOON</au><au>MOON BYUNG-WOONG</au><au>KIM JAE-RIN</au><au>KIM SU-HAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR MANUFACTURING TRANSFER FILM INCLUDING SEED LAYER, METHOD FOR MANUFACTURING CIRCUIT BOARD BY SELECTIVELY ETCHING SEED LAYER, AND ETCHING SOLUTION COMPOSITE</title><date>2019-11-22</date><risdate>2019</risdate><abstract>The present invention relates to a method for manufacturing a transfer film including an electrode layer, the method comprising: an electrode layer formation step of forming an electrode layer on a carrier member by using a conductive material; a placement step of placing the carrier member on at least one side of an insulating resin layer respectively; a bonding step of bonding the carrier memberand the insulating resin layer together by applying pressure thereto; and a transfer step of removing the carrier member to transfer the electrode layer on the insulating resin layer.
本发明涉及一种包括电极层的转印膜的制造方法。根据本发明的包括电极层的转印膜的制造方法，其特征在于包括：在载体部件上利用导电性物质形成电极层的电极层形成步骤；在绝缘树脂层的至少一面上分别配设所述载体部件的配设步骤；加压所述载体部件和所述绝缘树脂层使之接合的接合步骤；及去除载体部件以在所述绝缘树脂层上转印电极层的转印步骤。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRICITY INSULATORS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES |
| title | METHOD FOR MANUFACTURING TRANSFER FILM INCLUDING SEED LAYER, METHOD FOR MANUFACTURING CIRCUIT BOARD BY SELECTIVELY ETCHING SEED LAYER, AND ETCHING SOLUTION COMPOSITE |
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