METHOD FOR MANUFACTURING TRANSFER FILM INCLUDING SEED LAYER, METHOD FOR MANUFACTURING CIRCUIT BOARD BY SELECTIVELY ETCHING SEED LAYER, AND ETCHING SOLUTION COMPOSITE

The present invention relates to a method for manufacturing a transfer film including an electrode layer, the method comprising: an electrode layer formation step of forming an electrode layer on a carrier member by using a conductive material; a placement step of placing the carrier member on at least one side of an insulating resin layer respectively; a bonding step of bonding the carrier memberand the insulating resin layer together by applying pressure thereto; and a transfer step of removing the carrier member to transfer the electrode layer on the insulating resin layer. 本发明涉及一种包括电极层的转印膜的制造方法。根据本发明的包括电极层的转印膜的制造方法，其特征在于包括：在载体部件上利用导电性物质形成电极层的电极层形成步骤；在绝缘树脂层的至少一面上分别配设所述载体部件的配设步骤；加压所述载体部件和所述绝缘树脂层使之接合的接合步骤；及去除载体部件以在所述绝缘树脂层上转印电极层的转印步骤。