Preparation method of shape memory polymer-based circuit board based on swelling-in-situ polymerization reaction

The invention discloses a preparation method of a shape memory polymer-based circuit board based on swelling-in-situ polymerization reaction, and relates to a preparation method of a circuit board, and the substrate of the circuit board is an insulating shape memory polymer; carrying out linear inde...

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Hauptverfasser: YANG HAODONG, WANG CAOWEI, JIANG JIANG, GU XIAO, WU XUELIAN, XU FAN
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention discloses a preparation method of a shape memory polymer-based circuit board based on swelling-in-situ polymerization reaction, and relates to a preparation method of a circuit board, and the substrate of the circuit board is an insulating shape memory polymer; carrying out linear indentation pre-deformation treatment on the surface of the circuit board substrate; introducing an organic solvent into the indentation structure, and enabling the organic solvent to enter the indentation/groove structure material so as to enable the indentation area material to swell within a certaindepth range; sequentially introducing a conductive polymer monomer and an auxiliary agent for polymerizing the conductive polymer monomer to generate a conductive polymer into a swelled indentation structure, wherein the conductive polymer raw material monomer is subjected to in-situ polymerization reaction to generate the conductive polymer by taking a network gap, formed by a molecular chain segment of a material in a s