Protective material for electronic circuit, protective sealing material for electronic circuit, sealing method, and method for manufacturing semiconductor device

Provided is a protective material for an electronic circuit that satisfies at least the conditions in (1) or (2): (1) a protective material for an electronic circuit that comprises a resin constituentand an inorganic filler, with the filler content ratio being at least 50% by mass of the whole; (2) a protective material for an electronic circuit that comprises a resin component and an inorganic filler, the protective material being configured such that, if the viscosity (Pa.s) measured at 75 degrees centigrade and a shear velocity of 5s-1 is viscosity A and the viscosity (Pa.s) measured at 75degrees centigrade and a shear velocity of 50s-1 is viscosity B, the thixotropic index at 75 degrees centigrade, obtained as the value of viscosity A/viscosity B, is in the range 0.1-2.5. 一种电子电路保护材料，其满足下述(1)或(2)中的至少任一者。(1)一种电子电路保护材料，其含有树脂成分和无机填充材料，上述无机填充材料的含有率为整体的50质量％以上。(2)一种电子电路保护材料，其含有树脂成分和无机填充材料，在将75℃、剪切速度5s的条件下所测定的粘度(Pa·s)设为粘度A，且将75℃、剪切速度50s的条件下所测定的粘度(Pa·s)设为粘度B时，作为粘度A/粘度B的值而得到的75℃下的触变指数为0.1～2.5。