Electronic package and a method of fabricating the same

An electronic package and a method of fabricating the same, including disposing an electronic component on a lower side of a carrier structure and combining an antenna structure on an upper side of the carrier structure, in which the antenna structure includes an insulator and an antenna body, thereby reducing a thickness of the electronic package and improving antenna performance at the same time. 一种电子封装件及其制法，包括于承载结构下侧接置电子元件，且于该承载结构上侧结合天线结构，其中，该天线结构包含有绝缘体与天线本体，借此缩小该电子封装件的厚度且同时提升天线效能。