Packaging structure for three-dimensional integration of radio frequency system and design method thereof

The invention discloses a packaging structure for three-dimensional integration of a radio frequency system and a design method thereof. The structure comprises a silicon-based adapter plate and at least two supporting interconnection adapter plates which are alternately and longitudinally stacked f...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WU XIAODONG, HU LIULIN, CHEN YIJUN, XIAO LONG, HOU JIE, HU XINXIN, HE SHUWEI, WANG BING, LI QIANGBIN, MA SHENGLIN, ZHOU PENG, LU CHAOBAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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