Packaging structure for three-dimensional integration of radio frequency system and design method thereof

The invention discloses a packaging structure for three-dimensional integration of a radio frequency system and a design method thereof. The structure comprises a silicon-based adapter plate and at least two supporting interconnection adapter plates which are alternately and longitudinally stacked from bottom to top, wherein a cavity is formed between the at least two supporting interconnection adapter plates; each of the silicon-based adapter plate and the supporting interconnection adapter plates comprises a silicon substrate, a through silicon via (TSV), micro bumps and an RDL wiring layer.The TSV penetrates the silicon substrate; the RDL wiring layers are arranged on the upper surface and the lower surface of the silicon substrate; the micro bumps are arranged on the two RDL wiring layers; the TSV, the RDL wiring layers, and the micro bumps are connected with one another. The structure has the effects of vertical interconnection and structural support, three-dimensional vertical stacking of radio frequenc