SUBSTRATE PROCESSING APPARATUS AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT
The invention provides a substrate processing apparatus and a method of manufacturing an electronic component, and aims to suppress mixing of atmosphere gas between processing regions in a substrate processing apparatus having a plurality of processing regions in one chamber. The substrate processin...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention provides a substrate processing apparatus and a method of manufacturing an electronic component, and aims to suppress mixing of atmosphere gas between processing regions in a substrate processing apparatus having a plurality of processing regions in one chamber. The substrate processing apparatus includes a chamber having a configuration in which a substrate is processed. That is, the chamber is provided with a first region for performing a first process on a substrate and a second region for performing a second process on the substrate, the first region and the second region being spatially open, and the chamber has: a first introduction port for introducing a first gas used in the first process into the first region; a second introduction port for introducing a second gas used in the second process into the second region; and an exhaust port provided at or near an interface between the first region and the second region.
本发明提供基板处理装置以及电子零件的制造方法,在一个腔室内具有多个处理区域的基板处理装置中,用于抑制处理区域间的气氛气体的混合。基板处理装置具有如 |
---|