SUBSTRATE PROCESSING APPARATUS AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT

The invention provides a substrate processing apparatus and a method of manufacturing an electronic component, and aims to suppress mixing of atmosphere gas between processing regions in a substrate processing apparatus having a plurality of processing regions in one chamber. The substrate processin...

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Hauptverfasser: WATABE ARATA, ABE YOSHIKO
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention provides a substrate processing apparatus and a method of manufacturing an electronic component, and aims to suppress mixing of atmosphere gas between processing regions in a substrate processing apparatus having a plurality of processing regions in one chamber. The substrate processing apparatus includes a chamber having a configuration in which a substrate is processed. That is, the chamber is provided with a first region for performing a first process on a substrate and a second region for performing a second process on the substrate, the first region and the second region being spatially open, and the chamber has: a first introduction port for introducing a first gas used in the first process into the first region; a second introduction port for introducing a second gas used in the second process into the second region; and an exhaust port provided at or near an interface between the first region and the second region. 本发明提供基板处理装置以及电子零件的制造方法,在一个腔室内具有多个处理区域的基板处理装置中,用于抑制处理区域间的气氛气体的混合。基板处理装置具有如