Pressure-sensitive adhesive tape, preparation method thereof, and resin composition used for preparing pressure-sensitive adhesive tape

The invention belongs to the field of optical adhesive tape, and discloses a p pressure-sensitive adhesive tape, a preparation method thereof, and a resin composition used for preparing the pressure-sensitive adhesive tape. The resin composition comprises, by mass, polyacrylic resin of 90 to 98%; a...

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Bibliographische Detailangaben
Hauptverfasser: DONG BUTAN, WU GUISEN, ZHANG YUJUAN, QIAO LIGEN, ZHONG JUNWEN
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention belongs to the field of optical adhesive tape, and discloses a p pressure-sensitive adhesive tape, a preparation method thereof, and a resin composition used for preparing the pressure-sensitive adhesive tape. The resin composition comprises, by mass, polyacrylic resin of 90 to 98%; a photopolymerizable monomer of 0 to 6%; a photoinitiator of 0 to 2%; and a curing agent of 0.01 to 2%, wherein the polyacrylic resin is prepared through polymerization of a soft monomer, a hard monomer, and a functional monomer; the functional monomer comprises at least one selected from a hydroxy containing monomer, a carboxyl containing monomer, an epoxide group containing monomer, and a nitrogen containing monomer. The adding amount of the different kinds of monomers in the resin composition is controlled, so that the resin composition of different properties is obtained; and combination of the resin composition of different properties is capable of producing the pressure-sensitive adhesive tape high in peeling s