SEMICONDUCTOR PACKAGE DEVICE AND MANUFACTURING METHOD THEREFOR

Provided is a semiconductor package device comprising: a wiring layer that has an insulative section and a conductive section; a plurality of semiconductor packages disposed in contact with the uppersurface of the wiring layer; and a resin section for sealing the semiconductor packages. 半导体封装装置具有：布线...

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1. Verfasser:	HOSOMI EIICHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Provided is a semiconductor package device comprising: a wiring layer that has an insulative section and a conductive section; a plurality of semiconductor packages disposed in contact with the uppersurface of the wiring layer; and a resin section for sealing the semiconductor packages. 半导体封装装置具有：布线层，其具有绝缘部和导电部；多个半导体封装，它们与所述布线层的上表面接触而配置；以及树脂部，其密封所述半导体封装。