ELECTROSTATIC CHUCK WITH FLEXIBLE WAFER TEMPERATURE CONTROL

An apparatus for processing a substrate is provided. A first coolant gas pressure system, a second coolant gas pressure system, a third coolant gas pressure system, and a fourth coolant gas pressure system are provided to provide independent gas pressures. An electrostatic chuck has a chuck surface...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MATYUSHKIN ALEXANDER, WILCOXSON MARK H, HAO FANGLI, HOLLAND JOHN P, OZEL TANER, COMENDANT KEITH
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!