Novel radio frequency transmission structure

The invention discloses a novel radio frequency transmission structure, which includes a silicon substrate and a radio frequency signal transmission through-silicon via TSV and a plurality of groundedthrough-silicon vias TSV disposed on the silicon substrate, wherein the radio frequency signal trans...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	WU XIAODONG, HU LIULIN, CHEN YIJUN, ZHOU WENJIN, XIAO LONG, HOU JIE, HE SHUWEI, WANG BING, LI QIANGBIN, MA SHENGLIN, ZHOU PENG, LU CHAOBAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!