Manufacturing method of metal salient point and chip

The invention discloses a manufacturing method of metal salient point and a chip. The method comprises the steps of at least performing first electroplating processing and second electroplating processing on a bonding pad of the chip, and respectively forming a first electroplating layer and a secon...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MO LEIQING, SUN BIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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