Manufacturing method of metal salient point and chip

The invention discloses a manufacturing method of metal salient point and a chip. The method comprises the steps of at least performing first electroplating processing and second electroplating processing on a bonding pad of the chip, and respectively forming a first electroplating layer and a second electroplating layer which are laminated, wherein at least one part of parameters of the first electroplating processing and the second electroplating processing are different; and annealing the chip. By the method, resources can be saved, the risk is reduced, and the production complexity is reduced. 本申请公开了一种金属凸点的制造方法和芯片，该方法包括：对芯片的焊盘至少进行第一电镀处理和第二电镀处理，分别形成层叠第一电镀层和第二电镀层，且第一电镀处理和第二电镀处理的至少部分参数不同；对芯片进行退火处理。通过上述方式，本申请能够节约资源，降低风险，降低生产复杂度。