HEAT TRANSFER FOR POWER MODULES

The invention relates to heat transfer for power modules. In one general aspect, an apparatus can include a module including a semiconductor die. The apparatus can include a heat sink coupled to the module and including a substrate, and a plurality of protrusions. The apparatus can include a cover i...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TEYSSEYRE JEROME, ROVEENDRA PAUL, LEE DUKYONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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