HEAT TRANSFER FOR POWER MODULES

The invention relates to heat transfer for power modules. In one general aspect, an apparatus can include a module including a semiconductor die. The apparatus can include a heat sink coupled to the module and including a substrate, and a plurality of protrusions. The apparatus can include a cover including a channel where the plurality of protrusions of the heat sink are disposed within the channel, and can include a sealing mechanism disposed between the cover and the module. 本发明题为"功率模块的热传递"。在一个一般方面，本发明公开了一种装置，所述装置可包括具有半导体管芯的模块。所述装置可包括散热器，所述散热器耦接到所述模块并且包括衬底和多个凸起。所述装置可包括具有通道的盖，其中所述散热器的所述多个凸起设置在所述通道内，并且所述装置可包括设置在所述盖和所述模块之间的密封机构。