Stamping die for patch diode lead frame
The invention discloses a stamping die for a patch diode lead frame. The stamping die comprises a movable die module, a female die module and a plurality of side protection structures, wherein the side protection structures are arranged on the sides of the movable die module and the female die modul...
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| creator | QIAN MIAO LU KAIPENG WANG SHIMING WU JIANBAO XIE FENG |
| description | The invention discloses a stamping die for a patch diode lead frame. The stamping die comprises a movable die module, a female die module and a plurality of side protection structures, wherein the side protection structures are arranged on the sides of the movable die module and the female die module; the movable die module comprises an auxiliary stripping structure, a plurality of guide posts, afirst stamping structure and a second stamping structure; the auxiliary stripping structure comprises a stripping driving piece and an abutting plate, and the stripping driving piece is fixedly connected with the abutting plate and drives the abutting plate to move; the first stamping structure and the second stamping structure are each provided with a plurality of punches; the female die module comprises a plurality of guide sleeves, supporting blocks and blanking grooves; the guide posts are accommodated in the guide sleeves in a matched mode; the first stamping structure and the second stamping structure face to th |
| format | Patent |
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The stamping die comprises a movable die module, a female die module and a plurality of side protection structures, wherein the side protection structures are arranged on the sides of the movable die module and the female die module; the movable die module comprises an auxiliary stripping structure, a plurality of guide posts, afirst stamping structure and a second stamping structure; the auxiliary stripping structure comprises a stripping driving piece and an abutting plate, and the stripping driving piece is fixedly connected with the abutting plate and drives the abutting plate to move; the first stamping structure and the second stamping structure are each provided with a plurality of punches; the female die module comprises a plurality of guide sleeves, supporting blocks and blanking grooves; the guide posts are accommodated in the guide sleeves in a matched mode; the first stamping structure and the second stamping structure face to th</description><language>chi ; eng</language><subject>MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL ; PERFORMING OPERATIONS ; PUNCHING METAL ; TRANSPORTING ; WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191108&DB=EPODOC&CC=CN&NR=110421057A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191108&DB=EPODOC&CC=CN&NR=110421057A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>QIAN MIAO</creatorcontrib><creatorcontrib>LU KAIPENG</creatorcontrib><creatorcontrib>WANG SHIMING</creatorcontrib><creatorcontrib>WU JIANBAO</creatorcontrib><creatorcontrib>XIE FENG</creatorcontrib><title>Stamping die for patch diode lead frame</title><description>The invention discloses a stamping die for a patch diode lead frame. The stamping die comprises a movable die module, a female die module and a plurality of side protection structures, wherein the side protection structures are arranged on the sides of the movable die module and the female die module; the movable die module comprises an auxiliary stripping structure, a plurality of guide posts, afirst stamping structure and a second stamping structure; the auxiliary stripping structure comprises a stripping driving piece and an abutting plate, and the stripping driving piece is fixedly connected with the abutting plate and drives the abutting plate to move; the first stamping structure and the second stamping structure are each provided with a plurality of punches; the female die module comprises a plurality of guide sleeves, supporting blocks and blanking grooves; the guide posts are accommodated in the guide sleeves in a matched mode; the first stamping structure and the second stamping structure face to th</description><subject>MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL</subject><subject>PERFORMING OPERATIONS</subject><subject>PUNCHING METAL</subject><subject>TRANSPORTING</subject><subject>WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAPLknMLcjMS1dIyUxVSMsvUihILEnOAPLyU1IVclITUxTSihJzU3kYWNMSc4pTeaE0N4Oim2uIs4duakF-fGpxQWJyal5qSbyzn6GhgYmRoYGpuaMxMWoAWKInKg</recordid><startdate>20191108</startdate><enddate>20191108</enddate><creator>QIAN MIAO</creator><creator>LU KAIPENG</creator><creator>WANG SHIMING</creator><creator>WU JIANBAO</creator><creator>XIE FENG</creator><scope>EVB</scope></search><sort><creationdate>20191108</creationdate><title>Stamping die for patch diode lead frame</title><author>QIAN MIAO ; LU KAIPENG ; WANG SHIMING ; WU JIANBAO ; XIE FENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN110421057A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2019</creationdate><topic>MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL</topic><topic>PERFORMING OPERATIONS</topic><topic>PUNCHING METAL</topic><topic>TRANSPORTING</topic><topic>WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL</topic><toplevel>online_resources</toplevel><creatorcontrib>QIAN MIAO</creatorcontrib><creatorcontrib>LU KAIPENG</creatorcontrib><creatorcontrib>WANG SHIMING</creatorcontrib><creatorcontrib>WU JIANBAO</creatorcontrib><creatorcontrib>XIE FENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>QIAN MIAO</au><au>LU KAIPENG</au><au>WANG SHIMING</au><au>WU JIANBAO</au><au>XIE FENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Stamping die for patch diode lead frame</title><date>2019-11-08</date><risdate>2019</risdate><abstract>The invention discloses a stamping die for a patch diode lead frame. The stamping die comprises a movable die module, a female die module and a plurality of side protection structures, wherein the side protection structures are arranged on the sides of the movable die module and the female die module; the movable die module comprises an auxiliary stripping structure, a plurality of guide posts, afirst stamping structure and a second stamping structure; the auxiliary stripping structure comprises a stripping driving piece and an abutting plate, and the stripping driving piece is fixedly connected with the abutting plate and drives the abutting plate to move; the first stamping structure and the second stamping structure are each provided with a plurality of punches; the female die module comprises a plurality of guide sleeves, supporting blocks and blanking grooves; the guide posts are accommodated in the guide sleeves in a matched mode; the first stamping structure and the second stamping structure face to th</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL PERFORMING OPERATIONS PUNCHING METAL TRANSPORTING WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL |
| title | Stamping die for patch diode lead frame |
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