Stamping die for patch diode lead frame

The invention discloses a stamping die for a patch diode lead frame. The stamping die comprises a movable die module, a female die module and a plurality of side protection structures, wherein the side protection structures are arranged on the sides of the movable die module and the female die module; the movable die module comprises an auxiliary stripping structure, a plurality of guide posts, afirst stamping structure and a second stamping structure; the auxiliary stripping structure comprises a stripping driving piece and an abutting plate, and the stripping driving piece is fixedly connected with the abutting plate and drives the abutting plate to move; the first stamping structure and the second stamping structure are each provided with a plurality of punches; the female die module comprises a plurality of guide sleeves, supporting blocks and blanking grooves; the guide posts are accommodated in the guide sleeves in a matched mode; the first stamping structure and the second stamping structure face to th