Heat dissipation device of sealed case and sealed case
The invention relates to the technical field of heat dissipation, and discloses a heat dissipation device of a sealed case and the sealed case. The heat dissipation device, which is used to dissipatethe heat of heating electronic components installed in the case, includes an internal heat transfer s...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to the technical field of heat dissipation, and discloses a heat dissipation device of a sealed case and the sealed case. The heat dissipation device, which is used to dissipatethe heat of heating electronic components installed in the case, includes an internal heat transfer system and an external heat transfer system. The internal heat transfer system is located in the sealed case and is in butt joint with the heating electronic components, and the heat generated by the heating electronic components can be transferred to the internal heat transfer system. The externalheat transfer system includes a blowing part and heat dissipation cover plates. The heat dissipation cover plates are all made of vapor chambers, and the blowing part is arranged on the inner side ofthe heat dissipation cover plates. The external heat transfer system is used to transfer the heat outside a sealed area to the outside air. The heat dissipation cover plates are connected with one another, can transfer heat to |
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