Hearing aid with bone conduction and air conduction functions
The invention discloses a hearing aid with bone conduction and air conduction functions. The hearing aid comprises: a horn body, wherein the loudspeaker body comprises a loudspeaker host part and an earphone part connected with the loudspeaker host part through a wire; a PCB arranged in the loudspea...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a hearing aid with bone conduction and air conduction functions. The hearing aid comprises: a horn body, wherein the loudspeaker body comprises a loudspeaker host part and an earphone part connected with the loudspeaker host part through a wire; a PCB arranged in the loudspeaker host part; a MCU chip is arranged on the PCB; a voice processing chip arranged on the PCB, wherein the voice processing chip is connected with the MCU chip; a bone conduction module and an air conduction module which are arranged in the earphone part, wherein the bone conduction module and the air conduction module are both connected with the voice processing chip. The bone conduction module is used for guaranteeing the low frequency of the sound, the air conduction module is used for guaranteeing the high frequency of the sound, and the integrity of the high and low frequency bands of the sound is guaranteed.
本发明公开了一种具有骨传导和气导功能的助听器,包括喇叭本体;其中,所述喇叭本体包括喇叭主机部、和与所述喇叭主机部通过导线连接的耳机部;设置在所述喇叭主机部内的PCB电路板;设置在所述PCB电路板上的MCU |
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