EPOXY CASTING RESIN FORMULATION

The present disclosure provides a curable casting resin precursor, comprising (a) a first part (A) comprising: (a1) at least one epoxy resin; (b) a second part (B) comprising: (b1) at least one firstamine-based epoxy curing agent; (b2) optionally, at least one second amine-based epoxy curing agent;...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MUTH MATHIS A, JUNG ADRIAN T, PETRY MICHAEL
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Zusammenfassung:The present disclosure provides a curable casting resin precursor, comprising (a) a first part (A) comprising: (a1) at least one epoxy resin; (b) a second part (B) comprising: (b1) at least one firstamine-based epoxy curing agent; (b2) optionally, at least one second amine-based epoxy curing agent; (b3) at least one mineral filler; and (b4) at least one phenolic lipid, wherein part (A) and/or part (B) comprise at least one triphenylmethane dye. The curable casting resin precursor is suited for encapsulating metal parts such as cable joints and the like. 本公开提供了一种可固化浇注树脂前体,所述可固化浇注树脂前体包含(a)第一部分(A),所述第一部分包含:(a1)至少一种环氧树脂;(b)第二部分(B),所述第二部分包含:(b1)至少一种第一胺基环氧固化剂;(b2)任选地,至少一种第二胺基环氧固化剂;(b3)至少一种矿物填料;(b4)至少一种酚脂;其中部分(A)和/或部分(B)包含至少一种三苯基甲烷染料。所述可固化浇注树脂前体适于封装金属部件诸如线缆接头等。