Process for 420-500 micron ultra-thick electrolytic copper foil

The invention discloses a process for a 420-500 micron ultra-thick electrolytic copper foil. The process comprises the following steps of 1, unreeling; 2, activating; 3, pickling; 4, coarsening and curing; 5, carrying out barrier layer treatment; 6, carrying out anti-oxidation treatment; 7, carrying out organic treatment; and 8, drying and rolling. According to the process, the effect of radiatingheat generated by components outside a substrate can be achieved, so that the purpose of high-density interconnection of high-power electric appliances is achieved, the original power transmission forms such as cable wiring, metal plate bars and the like are replaced, the production efficiency is improved, and the labor-hour cost, the cost of cables and accessories, the cost of maintenance management and the like of wiring are reduced; the copper foil high-current substrate can effectively reduce the thermal load of a PCB and achieve quality homogenization, so that the reliability of a terminal complete machine produ