Turn type semiconductor cleavage device

The invention relates to a turn type semiconductor cleavage device. The turn type semiconductor cleavage device is provided with a supporting frame arranged on a bottom plate, a wafer turn mechanism is placed in a groove in the middle of the supporting frame, a wafer fracturing mechanism and a wafer scratching mechanism are arranged at the two ends of the supporting frame correspondingly, moreover, the wafer fracturing mechanism and the wafer scratching mechanism can move along guide rails on the two sides of the supporting frame correspondingly, a fracturing disc is placed at the position, located at one end of the wafer fracturing mechanism, of the supporting frame, a wafer adsorption disc is positioned and connected at the position, located at one end of the wafer scratching mechanism,of the supporting frame, a wafer is placed on the wafer adsorption disc, a plurality of groups of equally-spaced scratches are scratched on the wafer through the wafer scratching mechanism, and the scratched wafer and the waf