SUBSTRATE PLACING APPARATUS AND SUBSTRATE PLACING METHOD

The present invention provides a technique for placing a substrate in a horizontal posture when the substrate is placed on a placing table. A plurality of protrusions each supporting a substrate are formed on a surface of the mounting table. When the substrate is mounted on the mounting table, the suction hole pairs are different from the regions located above the projections by the suction holes.When the area is sucked, the substrate is sucked on the mounting table, and then the suction of the suction hole is reduced. Therefore, it is possible to mount the substrate on the mounting table while eliminating the warpage of the substrate, and to suppress the deformation of the substrate caused by the lower surface of the wafer W being strongly attracted, and the substrate can be placed on the mounting table in a horizontal posture. 本发明提供一种在载置台载置基片时，以水平的姿态载置基片的技术。载置台在表面形成有各自支承基片的多个突起，在该载置台载置基片时，由吸引孔对与载置与上述载置台的基片的、位于上述突起的上方的区域不同的区域进行了吸引的状态下，将基片吸附在载置台，之后减小吸引孔的吸引。因此，能够在消除了基片的翘曲的状态下将基片载置在载置台，并且能够抑制因较强地吸引晶片W的下表面而产生的基片