Electron beam curing compound adhesive, flexible package compound film and preparation method thereof

The invention discloses an electron beam curing compound adhesive. The electron beam curing compound adhesive is prepared from the raw materials in parts by mass: 30-50 parts of two-degree-of-functionality aliphatic polyurethane acrylate, 10-30 parts of two-degree-of-functionality polyester acrylate, 10-15 parts of acryloylmorpholine, 10-20 parts of N,N-dimethylacrylamide, 10-15 parts of an organic and inorganic hybrid material and 0.5-2 parts of a silane coupling agent. According to the electron beam curing compound adhesive, an electron beam is adopted for curing, curing is fast, curing canbe achieved instantaneously (curing can be achieved for 0.01 second or even 0.005 second), and before the electron beam is not adopted for curing, the compound adhesive can be used repeatedly. The invention further discloses a flexible package compound film prepared from the electron beam curing compound adhesive and a preparation method of the flexible package compound film. 本发明公开了一种电子束固化复合胶，由以下质量份配比的原料制成：2官能度脂肪族聚氨酯丙烯酸酯3