INSPECTION SYSTEM AND MALFUNCTION ANALYSIS/PREDICTION METHOD FOR INSPECTION SYSTEM
An inspection device (100) having: a prober (200) that has a stage (26) holding a substrate (W) having a plurality of devices formed thereupon, a transport unit (22) that transports the substrate (W)to the stage (26), and a probe card (25) that causes a plurality of probes 25a to come in contact wit...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | KAGAMI TETSUYA |
| description | An inspection device (100) having: a prober (200) that has a stage (26) holding a substrate (W) having a plurality of devices formed thereupon, a transport unit (22) that transports the substrate (W)to the stage (26), and a probe card (25) that causes a plurality of probes 25a to come in contact with electrodes in the plurality of devices upon the substrate (W); a tester (300) that applies an electric signal to the plurality of devices upon the substrate (W) via the probe card (25) and inspects the electrical characteristics of the devices; and a malfunction analysis/prediction unit (400) that, when a malfunction has occurred during inspection or a sign indicates a stage prior to a malfunction, analyzes history information for the prober (200) and tester (300) related to that malfunctionand ascertains or predicts the location of the malfunction.
检查装置(100)具有：探测器(200)，其具有用于保持形成有多个器件的基板(W)的载置台(26)、将基板(W)搬送到载置台(26)的搬送部(22)以及使多个探针(25a)与基板(W)上的多个器件的电极接触的探针卡(25)；测试器(300)，其经由探针卡(25)将向基板(W)上的多个器件提供电信号，来检查器件的电气特性；以及故障分 |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN110383443A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN110383443A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN110383443A3</originalsourceid><addsrcrecordid>eNrjZAjy9AsOcHUO8fT3UwiODA5x9VVw9HNR8HX0cQv1gwg7-jn6RAZ7BusHBLm6eELEfF1DPPxdFNz8gxQwDOBhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGBsYWxiYmxo7GxKgBACJPMDA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>INSPECTION SYSTEM AND MALFUNCTION ANALYSIS/PREDICTION METHOD FOR INSPECTION SYSTEM</title><source>esp@cenet</source><creator>KAGAMI TETSUYA</creator><creatorcontrib>KAGAMI TETSUYA</creatorcontrib><description>An inspection device (100) having: a prober (200) that has a stage (26) holding a substrate (W) having a plurality of devices formed thereupon, a transport unit (22) that transports the substrate (W)to the stage (26), and a probe card (25) that causes a plurality of probes 25a to come in contact with electrodes in the plurality of devices upon the substrate (W); a tester (300) that applies an electric signal to the plurality of devices upon the substrate (W) via the probe card (25) and inspects the electrical characteristics of the devices; and a malfunction analysis/prediction unit (400) that, when a malfunction has occurred during inspection or a sign indicates a stage prior to a malfunction, analyzes history information for the prober (200) and tester (300) related to that malfunctionand ascertains or predicts the location of the malfunction.
检查装置(100)具有：探测器(200)，其具有用于保持形成有多个器件的基板(W)的载置台(26)、将基板(W)搬送到载置台(26)的搬送部(22)以及使多个探针(25a)与基板(W)上的多个器件的电极接触的探针卡(25)；测试器(300)，其经由探针卡(25)将向基板(W)上的多个器件提供电信号，来检查器件的电气特性；以及故障分</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191025&DB=EPODOC&CC=CN&NR=110383443A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191025&DB=EPODOC&CC=CN&NR=110383443A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAGAMI TETSUYA</creatorcontrib><title>INSPECTION SYSTEM AND MALFUNCTION ANALYSIS/PREDICTION METHOD FOR INSPECTION SYSTEM</title><description>An inspection device (100) having: a prober (200) that has a stage (26) holding a substrate (W) having a plurality of devices formed thereupon, a transport unit (22) that transports the substrate (W)to the stage (26), and a probe card (25) that causes a plurality of probes 25a to come in contact with electrodes in the plurality of devices upon the substrate (W); a tester (300) that applies an electric signal to the plurality of devices upon the substrate (W) via the probe card (25) and inspects the electrical characteristics of the devices; and a malfunction analysis/prediction unit (400) that, when a malfunction has occurred during inspection or a sign indicates a stage prior to a malfunction, analyzes history information for the prober (200) and tester (300) related to that malfunctionand ascertains or predicts the location of the malfunction.
检查装置(100)具有：探测器(200)，其具有用于保持形成有多个器件的基板(W)的载置台(26)、将基板(W)搬送到载置台(26)的搬送部(22)以及使多个探针(25a)与基板(W)上的多个器件的电极接触的探针卡(25)；测试器(300)，其经由探针卡(25)将向基板(W)上的多个器件提供电信号，来检查器件的电气特性；以及故障分</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAjy9AsOcHUO8fT3UwiODA5x9VVw9HNR8HX0cQv1gwg7-jn6RAZ7BusHBLm6eELEfF1DPPxdFNz8gxQwDOBhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGBsYWxiYmxo7GxKgBACJPMDA</recordid><startdate>20191025</startdate><enddate>20191025</enddate><creator>KAGAMI TETSUYA</creator><scope>EVB</scope></search><sort><creationdate>20191025</creationdate><title>INSPECTION SYSTEM AND MALFUNCTION ANALYSIS/PREDICTION METHOD FOR INSPECTION SYSTEM</title><author>KAGAMI TETSUYA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN110383443A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KAGAMI TETSUYA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAGAMI TETSUYA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>INSPECTION SYSTEM AND MALFUNCTION ANALYSIS/PREDICTION METHOD FOR INSPECTION SYSTEM</title><date>2019-10-25</date><risdate>2019</risdate><abstract>An inspection device (100) having: a prober (200) that has a stage (26) holding a substrate (W) having a plurality of devices formed thereupon, a transport unit (22) that transports the substrate (W)to the stage (26), and a probe card (25) that causes a plurality of probes 25a to come in contact with electrodes in the plurality of devices upon the substrate (W); a tester (300) that applies an electric signal to the plurality of devices upon the substrate (W) via the probe card (25) and inspects the electrical characteristics of the devices; and a malfunction analysis/prediction unit (400) that, when a malfunction has occurred during inspection or a sign indicates a stage prior to a malfunction, analyzes history information for the prober (200) and tester (300) related to that malfunctionand ascertains or predicts the location of the malfunction.
检查装置(100)具有：探测器(200)，其具有用于保持形成有多个器件的基板(W)的载置台(26)、将基板(W)搬送到载置台(26)的搬送部(22)以及使多个探针(25a)与基板(W)上的多个器件的电极接触的探针卡(25)；测试器(300)，其经由探针卡(25)将向基板(W)上的多个器件提供电信号，来检查器件的电气特性；以及故障分</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN110383443A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | INSPECTION SYSTEM AND MALFUNCTION ANALYSIS/PREDICTION METHOD FOR INSPECTION SYSTEM |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-09T03%3A26%3A06IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KAGAMI%20TETSUYA&rft.date=2019-10-25&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN110383443A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |