SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

This semiconductor device is provided with: a primary molded body (10) formed by having a semiconductor chip (12) that has a detection unit for detecting physical quantities, and a primary molded resin (13) formed of a resin material; a housing component (20), in which an insertion hole (21) for inserting the primary molded body is formed; and a secondary molded resin (30), which is formed of a resin material, and which integrally covers a region exposed from the insertion hole, said region being a part of the surface of the primary molded body, and a housing component surface region includinga region surrounding the insertion hole. A primary molded body portion including the semiconductor chip is inserted into the insertion hole. 半导体装置具备：一次成型体(10)，具备具有检测物理量的检测部的半导体芯片(12)和由树脂材料制成的一次成型树脂(13)；框体零件(20)，形成有用于将一次成型体插入的插入孔(21)；二次成型树脂(30)，由树脂材料形成，将一次成型体的表面中的从插入孔露出的区域、和框体零件的表面中的包含将插入孔围绕的区域的一部分区域一体地覆盖。一次成型体的包含半导体芯片的部分插入于插入孔中。