HIGH PERFORMANCE HOT MELT ADHESIVES AND USES THEREOF

A high performance hot melt adhesive composition with higher heat stress and higher adhesion values at lower temperatures than a conventional hot melt adhesive is provided. Smaller quantities of the high performance hot melt may be used to provide similar performances as conventional hot melt adhesi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TORRES ANDREA MARIA PAREDES, CHEUNG CHUIWAH ALICE, HARWELL MICHAEL
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A high performance hot melt adhesive composition with higher heat stress and higher adhesion values at lower temperatures than a conventional hot melt adhesive is provided. Smaller quantities of the high performance hot melt may be used to provide similar performances as conventional hot melt adhesives. 本发明提供一种高性能热熔粘合剂组合物，与常规热熔粘合剂相比，其在较低温度下具有更高的热应力和更高的粘合力值。可以使用较少量的所述高性能热熔粘合剂来提供与常规热熔粘合剂相似的性能。