PLASMA PROCESSING APPARATUS AND METHOD OF TRANSFERRING WORKPIECE

A plasma processing apparatus capable of reducing adhesion of reaction products to a placing surface of a placing table includes a placing table having a placing surface on which a workpiece is placedto be subjected to a plasma processing; an elevator configured to raise and lower the workpiece with...

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Bibliographische Detailangaben
Hauptverfasser: TAKAYAMA WATARU, SUZUKI TAKAYUKI, FUKASAWA KIMIHIRO, MURAKAMI TAKAHIRO, HAYASAKA SHINICHIRO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:A plasma processing apparatus capable of reducing adhesion of reaction products to a placing surface of a placing table includes a placing table having a placing surface on which a workpiece is placedto be subjected to a plasma processing; an elevator configured to raise and lower the workpiece with respect to the placing surface of the placing table; and an elevator controller configured to control the elevator, during a period until a transfer of the workpiece begins after a completion of the plasma processing on the workpiece, to hold the workpiece at a position where the placing surface of the placing table and the workpiece are spaced apart from each other by a distance that prevents an intrusion of a reaction product, and control the elevator, when the transfer of the workpiece begins, to raise the workpiece from the position where the workpiece is held. 本发明提供能够减少反应生成物对载置台的载置面的附着的等离子体处理装置,其包括:载置台,具有载置作为等离子体处理的对象的被处理体的载置面;使被处理体相对于载置台的载置面升降的升降机构;和升降控制部,其在从对被处理体的等离子体处理结束至开始输送被处理体的期间,控制升降机构来将被处理体保持在载置台的载置面与