APPARATUS FOR USE IN FORMING AN ADAPTIVE LAYER AND A METHOD OF USING THE SAME

An apparatus can include a logic element configured to generate information corresponding to an adaptive layer to be formed over a current substrate based at least in part on a difference in flatnessprofiles associated with a first substrate chuck and a second substrate chuck. In another aspect, a m...

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Bibliographische Detailangaben
Hauptverfasser: CHERALA ANSHUMAN, MEISSL MARIO J
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:An apparatus can include a logic element configured to generate information corresponding to an adaptive layer to be formed over a current substrate based at least in part on a difference in flatnessprofiles associated with a first substrate chuck and a second substrate chuck. In another aspect, a method can include obtaining a difference in thickness profiles for the first and second chucks using a prior substrate, and forming an adaptive layer over a previously formed patterned layer of a current substrate and before forming a patterned resist layer aligned to the previously formed patterned layer. In an embodiment, the thickness profile of the adaptive layer is a function of the inverse of the difference in flatness profiles of the substrate chucks. The adaptive layer can help to reduce overlay error associated with different flatness profiles of substrate chucks. 本发明涉及用于形成自适应层的装置及其使用方法。一种装置可以包括逻辑元件,所述逻辑元件被配置为至少部分地基于与第一衬底卡盘和第二衬底卡盘相关联的平坦度分布的差异来生成与要在当前衬底上方形成的自适应层相对应的信息。在另一方面中,一种方法可以包括使用先前的衬底获得第一卡盘和第二卡盘的厚度分布的