ELECTROLYTIC PLATING APPARATUS AND METHOD

One embodiment of the present invention provides an electrolytic plating apparatus and an electrolytic plating method capable of disposing a sealing member and a contact member at an optimal locationand individually adjusting the pressing of the sealing member and the contact member. The electrolyti...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MIGITA TATSUO, SHOJI FUMITO, MURANO MASAHIKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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